Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging

Target Article

Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging; CP Wong, S Bollampally; 1999; doi_citing_unknown

Retraction

Treatise upon Electricity  ; Benjamin Wilson; 01/01/1753

doi_cited_unknown

Citation piece

Note: Open to append information.